BF

Benjamin V. Fasano

IBM: 3 patents #1,923 of 10,295Top 20%
Globalfoundries: 1 patents #828 of 2,145Top 40%
📍 New Windsor, NY: #2 of 14 inventorsTop 15%
🗺 New York: #1,050 of 11,723 inventorsTop 9%
Overall (2016): #47,075 of 481,213Top 10%
4
Patents 2016

Issued Patents 2016

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
9443799 Interposer with lattice construction and embedded conductive metal structures Jean Audet, Shidong Li 2016-09-13
9360644 Laser die and photonics die package Paul F. Fortier 2016-06-07
9293439 Electronic module assembly with patterned adhesive array Edmund Blackshear, Elaine Cyr, Paul F. Fortier, Marcus E. Interrante, Roger Lam +4 more 2016-03-22
9278401 Fill head interface with combination vacuum pressure chamber Glen N. Biggs, Russell A. Budd, John J. Garant, Peter A. Gruber, John P. Karidis +5 more 2016-03-08