Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9498837 | Vacuum transition for solder bump mold filling | Robert Haas, Bouwe W. Leenstra, Phillip W. Palmatier | 2016-11-22 |
| 9278401 | Fill head interface with combination vacuum pressure chamber | Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, Peter A. Gruber, John P. Karidis +5 more | 2016-03-08 |