PP

Phillip W. Palmatier

IBM: 2 patents #2,870 of 10,295Top 30%
Globalfoundries: 1 patents #828 of 2,145Top 40%
Overall (2016): #58,990 of 481,213Top 15%
3
Patents 2016

Issued Patents 2016

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9498837 Vacuum transition for solder bump mold filling John J. Garant, Robert Haas, Bouwe W. Leenstra 2016-11-22
9428841 Apparatuses, systems and methods that allow for selective removal of a specific metal from a multi-metal plating solution Charles L. Arvin, Stephen G. Dutka, John R. Pennacchia, Freddie Torres 2016-08-30
9278401 Fill head interface with combination vacuum pressure chamber Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John J. Garant, Peter A. Gruber +5 more 2016-03-08