Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9295166 | Double solder bumps on substrates for low temperature flip chip bonding | Paul A. Lauro, Jae-Woong Nah | 2016-03-22 |
| 9278401 | Fill head interface with combination vacuum pressure chamber | Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John J. Garant, John P. Karidis +5 more | 2016-03-08 |