Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9305894 | Constrained die adhesion cure process | Vijayeshwar D. Khanna, Oswald J. Mantilla | 2016-04-05 |
| 9293439 | Electronic module assembly with patterned adhesive array | Elaine Cyr, Benjamin V. Fasano, Paul F. Fortier, Marcus E. Interrante, Roger Lam +4 more | 2016-03-22 |