Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508789 | Electronic components on trenched substrates and method of forming same | David L. Questad, Jennifer V. Muncy, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit | 2016-11-29 |
| 9305894 | Constrained die adhesion cure process | Edmund Blackshear, Oswald J. Mantilla | 2016-04-05 |
| 9227261 | Vacuum carriers for substrate bonding | Sri M. Sri-Jayantha | 2016-01-05 |