Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508789 | Electronic components on trenched substrates and method of forming same | David L. Questad, Vijayeshwar D. Khanna, Jennifer V. Muncy, Arun Sharma, Lorenzo Valdevit | 2016-11-29 |
| 9437519 | Tim strain mitigation in electronic modules | Gerard McVicker | 2016-09-06 |
| 9227261 | Vacuum carriers for substrate bonding | Vijayeshwar D. Khanna | 2016-01-05 |