Issued Patents 2016
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515035 | Three-dimensional integrated circuit integration | Thomas A. Wassick | 2016-12-06 |
| 9508578 | Method and apparatus for detecting foreign material on a chuck | Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson +1 more | 2016-11-29 |
| 9484301 | Controlled metal extrusion opening in semiconductor structure and method of forming | Max G. Levy, Gary L. Milo, Matthew D. Moon, Anthony C. Speranza, David C. Thomas +1 more | 2016-11-01 |
| 9472490 | IC structure with recessed solder bump area and methods of forming same | Timothy M. Sullivan, Glen E. Richard, Stephen P. Ayotte | 2016-10-18 |
| 9404953 | Structures and methods for monitoring dielectric reliability with through-silicon vias | Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekharan Kothandaraman, John M. Safran | 2016-08-02 |
| 9362229 | Semiconductor devices with enhanced electromigration performance | Jeffrey P. Gambino, David L. Harame, Baozhen Li, Bjorn K. A. Zetterlund | 2016-06-07 |
| 9331037 | Preventing misshaped solder balls | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2016-05-03 |
| 9318414 | Integrated circuit structure with through-semiconductor via | Fen Chen, Minhua Lu, Ping-Chuan Wang, Lijuan Zhang | 2016-04-19 |
| 9318413 | Integrated circuit structure with metal cap and methods of fabrication | Fen Chen, Andrew Tae Kim, Minhua Lu, Ping-Chuan Wang, Lijuan Zhang | 2016-04-19 |
| 9275868 | Uniform roughness on backside of a wafer | Shawn A. Adderly, Jeffrey P. Gambino, Max L. Lifson, Matthew D. Moon, William J. Murphy +1 more | 2016-03-01 |
| 9269683 | Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2016-02-23 |
| 9230929 | Semiconductor structures and methods of manufacture | Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Christopher D. Muzzy, Wolfgang Sauter | 2016-01-05 |