| 9515035 |
Three-dimensional integrated circuit integration |
Thomas A. Wassick |
2016-12-06 |
| 9508578 |
Method and apparatus for detecting foreign material on a chuck |
Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson +1 more |
2016-11-29 |
| 9484301 |
Controlled metal extrusion opening in semiconductor structure and method of forming |
Max G. Levy, Gary L. Milo, Matthew D. Moon, Anthony C. Speranza, David C. Thomas +1 more |
2016-11-01 |
| 9472490 |
IC structure with recessed solder bump area and methods of forming same |
Timothy M. Sullivan, Glen E. Richard, Stephen P. Ayotte |
2016-10-18 |
| 9404953 |
Structures and methods for monitoring dielectric reliability with through-silicon vias |
Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekharan Kothandaraman, John M. Safran |
2016-08-02 |
| 9362229 |
Semiconductor devices with enhanced electromigration performance |
Jeffrey P. Gambino, David L. Harame, Baozhen Li, Bjorn K. A. Zetterlund |
2016-06-07 |
| 9331037 |
Preventing misshaped solder balls |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2016-05-03 |
| 9318414 |
Integrated circuit structure with through-semiconductor via |
Fen Chen, Minhua Lu, Ping-Chuan Wang, Lijuan Zhang |
2016-04-19 |
| 9318413 |
Integrated circuit structure with metal cap and methods of fabrication |
Fen Chen, Andrew Tae Kim, Minhua Lu, Ping-Chuan Wang, Lijuan Zhang |
2016-04-19 |
| 9275868 |
Uniform roughness on backside of a wafer |
Shawn A. Adderly, Jeffrey P. Gambino, Max L. Lifson, Matthew D. Moon, William J. Murphy +1 more |
2016-03-01 |
| 9269683 |
Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2016-02-23 |
| 9230929 |
Semiconductor structures and methods of manufacture |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Christopher D. Muzzy, Wolfgang Sauter |
2016-01-05 |
