Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484301 | Controlled metal extrusion opening in semiconductor structure and method of forming | Max G. Levy, Gary L. Milo, Matthew D. Moon, Anthony C. Speranza, Timothy D. Sullivan +1 more | 2016-11-01 |
| 9312205 | Methods of forming a TSV wafer with improved fracture strength | James W. Adkisson, Yoba Amoah, Jeffrey P. Gambino, Christine A. Leggett, Max L. Lifson +2 more | 2016-04-12 |
| 9275868 | Uniform roughness on backside of a wafer | Shawn A. Adderly, Jeffrey P. Gambino, Max L. Lifson, Matthew D. Moon, William J. Murphy +1 more | 2016-03-01 |