Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484301 | Controlled metal extrusion opening in semiconductor structure and method of forming | Max G. Levy, Gary L. Milo, Anthony C. Speranza, Timothy D. Sullivan, David C. Thomas +1 more | 2016-11-01 |
| 9390969 | Integrated circuit and interconnect, and method of fabricating same | David A. DeMuynck, Zhong-Xiang He, Daniel R. Miga, Daniel S. Vanslette, Eric J. White | 2016-07-12 |
| 9330988 | Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness | Shawn A. Adderly, Kyle Babinski, Daniel A. Delibac, David A. DeMuynck, Shawn R. Goddard +2 more | 2016-05-03 |
| 9275868 | Uniform roughness on backside of a wafer | Shawn A. Adderly, Jeffrey P. Gambino, Max L. Lifson, William J. Murphy, Timothy D. Sullivan +1 more | 2016-03-01 |