Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508680 | Induction heating for underfill removal and chip rework | Stephen P. Ayotte, Glen E. Richard | 2016-11-29 |
| 9472490 | IC structure with recessed solder bump area and methods of forming same | Glen E. Richard, Stephen P. Ayotte, Timothy D. Sullivan | 2016-10-18 |