Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508680 | Induction heating for underfill removal and chip rework | Glen E. Richard, Timothy M. Sullivan | 2016-11-29 |
| 9470740 | Screening methodology to eliminate wire sweep in bond and assembly module packaging | Michael Russell Uy Gonzales, Mark Tiam Weng Lam | 2016-10-18 |
| 9472490 | IC structure with recessed solder bump area and methods of forming same | Timothy M. Sullivan, Glen E. Richard, Timothy D. Sullivan | 2016-10-18 |
| 9230921 | Self-healing crack stop structure | Alissa R. Cote, Kendra A. Lyons, John C. Malinowski, Benjamin J. Pierce | 2016-01-05 |