ML

Mark Tiam Weng Lam

IBM: 3 patents #1,923 of 10,295Top 20%
📍 Singapore, SG: #88 of 1,474 inventorsTop 6%
Overall (2016): #63,270 of 481,213Top 15%
3
Patents 2016

Issued Patents 2016

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9470740 Screening methodology to eliminate wire sweep in bond and assembly module packaging Stephen P. Ayotte, Michael Russell Uy Gonzales 2016-10-18
9255867 Wire-pull test location identification on a wire of a microelectronic package Katsuyuki Yonehara 2016-02-09
9229446 Production line quality processes Ooi T. Ong 2016-01-05