Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466547 | Passivation layer topography | Charles L. Arvin, Brian M. Erwin, Jeffrey P. Gambino, Wolfgang Sauter | 2016-10-11 |
| 9397054 | Semiconductor structure with an interconnect level having a conductive pad and metallic structure such as a base of a crackstop | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2016-07-19 |
| 9331037 | Preventing misshaped solder balls | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2016-05-03 |
| 9269683 | Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2016-02-23 |
| 9257352 | Semiconductor test wafer and methods for use thereof | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2016-02-09 |
| 9230929 | Semiconductor structures and methods of manufacture | Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Wolfgang Sauter, Timothy D. Sullivan | 2016-01-05 |
| 9231046 | Capacitor using barrier layer metallurgy | Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Wolfgang Sauter | 2016-01-05 |