| 9466547 |
Passivation layer topography |
Charles L. Arvin, Brian M. Erwin, Jeffrey P. Gambino, Wolfgang Sauter |
2016-10-11 |
| 9397054 |
Semiconductor structure with an interconnect level having a conductive pad and metallic structure such as a base of a crackstop |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter |
2016-07-19 |
| 9331037 |
Preventing misshaped solder balls |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan |
2016-05-03 |
| 9269683 |
Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan |
2016-02-23 |
| 9257352 |
Semiconductor test wafer and methods for use thereof |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter |
2016-02-09 |
| 9230929 |
Semiconductor structures and methods of manufacture |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Wolfgang Sauter, Timothy D. Sullivan |
2016-01-05 |
| 9231046 |
Capacitor using barrier layer metallurgy |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Wolfgang Sauter |
2016-01-05 |
