Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466547 | Passivation layer topography | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2016-10-11 |
| 9431359 | Coaxial solder bump support structure | Ian D. Melville, Ekta Misra, George J. Scott | 2016-08-30 |
| 9401336 | Dual layer stack for contact formation | Charles L. Arvin, Harry D. Cox, Sarah H. Knickerbocker, Karen P. McLaughlin, David J. Russell | 2016-07-26 |
| 9343420 | Universal solder joints for 3D packaging | Eric D. Perfecto, Nicholas A. Polomoff, Jae-Woong Nah | 2016-05-17 |
| 9324669 | Use of electrolytic plating to control solder wetting | Charles L. Arvin, Eric D. Perfecto, Wolfgang Sauter | 2016-04-26 |