Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343420 | Universal solder joints for 3D packaging | Brian M. Erwin, Eric D. Perfecto, Jae-Woong Nah | 2016-05-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343420 | Universal solder joints for 3D packaging | Brian M. Erwin, Eric D. Perfecto, Jae-Woong Nah | 2016-05-17 |