Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9396991 | Multilayered contact structure having nickel, copper, and nickel-iron layers | Charles L. Arvin, Harry D. Cox, Thomas A. Wassick | 2016-07-19 |
| 9379007 | Electromigration-resistant lead-free solder interconnect structures | Charles L. Arvin, KENNETH BIRD, Charles C. Goldsmith, Sung K. Kang, Minhua Lu +4 more | 2016-06-28 |
| 9343420 | Universal solder joints for 3D packaging | Brian M. Erwin, Nicholas A. Polomoff, Jae-Woong Nah | 2016-05-17 |
| 9324669 | Use of electrolytic plating to control solder wetting | Charles L. Arvin, Brian M. Erwin, Wolfgang Sauter | 2016-04-26 |