Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515035 | Three-dimensional integrated circuit integration | Timothy D. Sullivan | 2016-12-06 |
| 9477568 | Managing interconnect electromigration effects | Malcolm S. Allen-Ware, Jon A. Casey, Sungjun Chun, Alan J. Drake, Charles R. Lefurgy +3 more | 2016-10-25 |
| 9396991 | Multilayered contact structure having nickel, copper, and nickel-iron layers | Charles L. Arvin, Harry D. Cox, Eric D. Perfecto | 2016-07-19 |
| 9379007 | Electromigration-resistant lead-free solder interconnect structures | Charles L. Arvin, KENNETH BIRD, Charles C. Goldsmith, Sung K. Kang, Minhua Lu +4 more | 2016-06-28 |