Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515051 | Metal to metal bonding for stacked (3D) integrated circuits | Tien-Jen Cheng, Mukta G. Farooq | 2016-12-06 |
| 9461017 | Electronic package that includes a plurality of integrated circuit devices bonded in a three-dimensional stack arrangement | Mukta G. Farooq, Andrew H. Simon, Anthony K. Stamper | 2016-10-04 |
| 9418865 | Wet etching of silicon containing antireflective coatings | Gregory Nowling | 2016-08-16 |
| 9257336 | Bottom-up plating of through-substrate vias | Mukta G. Farooq, Troy L. Graves-Abe | 2016-02-09 |
| 9252053 | Self-aligned contact structure | Rosa A. Orozco-Teran, Ravikumar Ramachandran, Russell H. Arndt, David L. Rath | 2016-02-02 |