Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515051 | Metal to metal bonding for stacked (3D) integrated circuits | Mukta G. Farooq, John A. Fitzsimmons | 2016-12-06 |
TC
Tien-Jen Cheng
Overall (2016): #203,228 of 481,213Top 45%
1
Patents 2016