Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502325 | Integrated circuit barrierless microfluidic channel | Lawrence A. Clevenger, Vincent J. McGahay, Yiheng Xu | 2016-11-22 |
| 9472710 | Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrate | Stephen M. Gates, Jason S. Orcutt, Jean-Olivier Plouchart, Spyridon Skordas | 2016-10-18 |
| 9455185 | Laser anneal of buried metallic interconnects including through silicon vias | Oleg Gluschenkov, Andrew J. Martin | 2016-09-27 |
| 9431485 | Formation of finFET junction | Shafaat Ahmed, Murshed Chowdhury, Aritra Dasgupta, Mohammad Hasanuzzaman, Shahrukh Khan | 2016-08-30 |
| 9412658 | Constrained nanosecond laser anneal of metal interconnect structures | Oleg Gluschenkov, Siddarth A. Krishnan, Andrew H. Simon, Shishir Ray | 2016-08-09 |
| 9412654 | Graphene sacrificial deposition layer on beol copper liner-seed for mitigating queue-time issues between liner and plating step | Junjing Bao, Lawrence A. Clevenger, Vincent J. McGahay, Richard S. Wise, Yiheng Xu | 2016-08-09 |
| 9385062 | Integrated circuit barrierless microfluidic channel | Lawrence A. Clevenger, Vincent J. McGahay, Yiheng Xu | 2016-07-05 |
| 9373561 | Integrated circuit barrierless microfluidic channel | Lawrence A. Clevenger, Vincent J. McGahay, Yiheng Xu | 2016-06-21 |
| 9362230 | Methods to form conductive thin film structures | Lawrence A. Clevenger, Vincent J. McGahay, Yiheng Xu | 2016-06-07 |
| 9293365 | Hardmask removal for copper interconnects with tungsten contacts by chemical mechanical polishing | Domingo A. Ferrer, Jim Shih-Chun Liang, Wei-Tsu Tseng, George S. Tulevski | 2016-03-22 |