| 9502325 |
Integrated circuit barrierless microfluidic channel |
Lawrence A. Clevenger, Vincent J. McGahay, Yiheng Xu |
2016-11-22 |
| 9472710 |
Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrate |
Stephen M. Gates, Jason S. Orcutt, Jean-Olivier Plouchart, Spyridon Skordas |
2016-10-18 |
| 9455185 |
Laser anneal of buried metallic interconnects including through silicon vias |
Oleg Gluschenkov, Andrew J. Martin |
2016-09-27 |
| 9431485 |
Formation of finFET junction |
Shafaat Ahmed, Murshed Chowdhury, Aritra Dasgupta, Mohammad Hasanuzzaman, Shahrukh Khan |
2016-08-30 |
| 9412658 |
Constrained nanosecond laser anneal of metal interconnect structures |
Oleg Gluschenkov, Siddarth A. Krishnan, Andrew H. Simon, Shishir Ray |
2016-08-09 |
| 9412654 |
Graphene sacrificial deposition layer on beol copper liner-seed for mitigating queue-time issues between liner and plating step |
Junjing Bao, Lawrence A. Clevenger, Vincent J. McGahay, Richard S. Wise, Yiheng Xu |
2016-08-09 |
| 9385062 |
Integrated circuit barrierless microfluidic channel |
Lawrence A. Clevenger, Vincent J. McGahay, Yiheng Xu |
2016-07-05 |
| 9373561 |
Integrated circuit barrierless microfluidic channel |
Lawrence A. Clevenger, Vincent J. McGahay, Yiheng Xu |
2016-06-21 |
| 9362230 |
Methods to form conductive thin film structures |
Lawrence A. Clevenger, Vincent J. McGahay, Yiheng Xu |
2016-06-07 |
| 9293365 |
Hardmask removal for copper interconnects with tungsten contacts by chemical mechanical polishing |
Domingo A. Ferrer, Jim Shih-Chun Liang, Wei-Tsu Tseng, George S. Tulevski |
2016-03-22 |
