Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472789 | Thin, flexible microsystem with integrated energy source | Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, John U. Knickerbocker, Eric P. Lewandowski +2 more | 2016-10-18 |
| 9343423 | No flow underfill or wafer level underfill and solder columns | Claudius Ferger, Jae-Woong Nah, Da-Yuan Shih | 2016-05-17 |
| 9321245 | Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion | Eric P. Lewandowski, Jae-Woong Nah, Robert J. Polastre | 2016-04-26 |
| 9305896 | No flow underfill or wafer level underfill and solder columns | Claudius Ferger, Jae-Woong Nah, Da-Yuan Shih | 2016-04-05 |
| 9272498 | Precast thermal interface adhesive for easy and repeated, separation and remating | Evan G. Colgan, Paul W. Coteus, Kenneth C. Marston, Steven P. Ostrander | 2016-03-01 |
| 9273408 | Direct injection molded solder process for forming solder bumps on wafers | Bing Dang, Paul A. Lauro, Jae-Woong Nah | 2016-03-01 |