Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343423 | No flow underfill or wafer level underfill and solder columns | Michael A. Gaynes, Jae-Woong Nah, Da-Yuan Shih | 2016-05-17 |
| 9305896 | No flow underfill or wafer level underfill and solder columns | Michael A. Gaynes, Jae-Woong Nah, Da-Yuan Shih | 2016-04-05 |