Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401315 | Thermal hot spot cooling for semiconductor devices | Paul F. Bodenweber, Taryn J. Davis, Marcus E. Interrante, Chenzhou Lian, Kathryn C. Rivera +2 more | 2016-07-26 |
| 9272498 | Precast thermal interface adhesive for easy and repeated, separation and remating | Evan G. Colgan, Paul W. Coteus, Michael A. Gaynes, Steven P. Ostrander | 2016-03-01 |