CL

Chenzhou Lian

Globalfoundries: 1 patents #828 of 2,145Top 40%
IBM: 1 patents #5,048 of 10,295Top 50%
Overall (2016): #153,036 of 481,213Top 35%
2
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9437515 Heat spreading layer with high thermal conductivity Evan G. Colgan, Taryn J. Davis, Yi Pan, Kamal K. Sikka, Jeffrey A. Zitz 2016-09-06
9401315 Thermal hot spot cooling for semiconductor devices Paul F. Bodenweber, Taryn J. Davis, Marcus E. Interrante, Kenneth C. Marston, Kathryn C. Rivera +2 more 2016-07-26