Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437515 | Heat spreading layer with high thermal conductivity | Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Yi Pan, Jeffrey A. Zitz | 2016-09-06 |
| 9401315 | Thermal hot spot cooling for semiconductor devices | Paul F. Bodenweber, Taryn J. Davis, Marcus E. Interrante, Chenzhou Lian, Kenneth C. Marston +2 more | 2016-07-26 |
| 9366591 | Determining magnitude of compressive loading | Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Jiantao Zheng, Jeffrey A. Zitz | 2016-06-14 |