Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508566 | Wafer level overmold for three dimensional surfaces | Paul S. Andry, Bing Dang, Jae-Woong Nah, Bucknell C. Webb | 2016-11-29 |
| 9472789 | Thin, flexible microsystem with integrated energy source | Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker +2 more | 2016-10-18 |
| 9321245 | Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion | Michael A. Gaynes, Jae-Woong Nah, Robert J. Polastre | 2016-04-26 |