Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431366 | Selective area heating for 3D chip stack | Mario J. Interrante | 2016-08-30 |
| 9385039 | Formation of through-silicon via (TSV) in silicon substrate | — | 2016-07-05 |
| 9373590 | Integrated circuit bonding with interposer die | Mario J. Interrante | 2016-06-21 |
| 9330946 | Method and structure of die stacking using pre-applied underfill | Mukta G. Farooq, Michael A. Gaynes | 2016-05-03 |
| 9263378 | Ball grid array and land grid array assemblies fabricated using temporary resist | Jae-Woong Nah, Charles L. Reynolds | 2016-02-16 |