MI

Mario J. Interrante

IBM: 2 patents #2,870 of 10,295Top 30%
📍 New Paltz, NY: #7 of 23 inventorsTop 35%
🗺 New York: #2,389 of 11,723 inventorsTop 25%
Overall (2016): #118,896 of 481,213Top 25%
2
Patents 2016

Issued Patents 2016

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9431366 Selective area heating for 3D chip stack Katsuyuki Sakuma 2016-08-30
9373590 Integrated circuit bonding with interposer die Katsuyuki Sakuma 2016-06-21