Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9252133 | Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures | Christopher N. Collins, Mukta G. Farooq, Troy L. Graves-Abe, Gerd Pfeiffer, Thuy L. Tran-Quinn | 2016-02-02 |