| 9472859 |
Integration of area efficient antennas for phased array or wafer scale array antenna applications |
Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Peter J. Sorce |
2016-10-18 |
| 9472789 |
Thin, flexible microsystem with integrated energy source |
Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker +2 more |
2016-10-18 |
| 9362223 |
Integrated circuit assembly with cushion polymer layer |
Paul S. Andry, Sarah H. Knickerbocker, Ron R. Legario, Melvin P. Zussman |
2016-06-07 |
| 9355936 |
Flattened substrate surface for substrate bonding |
Edward C. Cooney, III, James S. Dunn, Dale W. Martin, Charles S. Musante, BethAnn Rainey Lawrence +2 more |
2016-05-31 |
| 9331141 |
CMOS structure on replacement substrate |
Paul S. Andry, Edmund J. Sprogis |
2016-05-03 |
| 9324601 |
Low temperature adhesive resins for wafer bonding |
Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker |
2016-04-26 |
| 9313921 |
Chip stack structures that implement two-phase cooling with radial flow |
Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong |
2016-04-12 |
| 9269561 |
Wafer debonding using long-wavelength infrared radiation ablation |
Bing Dang, John U. Knickerbocker |
2016-02-23 |
