Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472859 | Integration of area efficient antennas for phased array or wafer scale array antenna applications | Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Peter J. Sorce | 2016-10-18 |
| 9472789 | Thin, flexible microsystem with integrated energy source | Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker +2 more | 2016-10-18 |
| 9362223 | Integrated circuit assembly with cushion polymer layer | Paul S. Andry, Sarah H. Knickerbocker, Ron R. Legario, Melvin P. Zussman | 2016-06-07 |
| 9355936 | Flattened substrate surface for substrate bonding | Edward C. Cooney, III, James S. Dunn, Dale W. Martin, Charles S. Musante, BethAnn Rainey Lawrence +2 more | 2016-05-31 |
| 9331141 | CMOS structure on replacement substrate | Paul S. Andry, Edmund J. Sprogis | 2016-05-03 |
| 9324601 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2016-04-26 |
| 9313921 | Chip stack structures that implement two-phase cooling with radial flow | Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong | 2016-04-12 |
| 9269561 | Wafer debonding using long-wavelength infrared radiation ablation | Bing Dang, John U. Knickerbocker | 2016-02-23 |