Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9245824 | Through-vias for wiring layers of semiconductor devices | Christopher V. Jahnes, Bucknell C. Webb | 2016-01-26 |
| 9236325 | Through-vias for wiring layers of semicondutor devices | Christopher V. Jahnes, Bucknell C. Webb | 2016-01-12 |