Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9475145 | Solder bump joint in a device including lamellar structures | Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih +1 more | 2016-10-25 |
| 9263407 | Method for manufacturing a plurality of metal posts | Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu | 2016-02-16 |