Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9475145 | Solder bump joint in a device including lamellar structures | Su-Chun Yang, Chung-Jung Wu, Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih +1 more | 2016-10-25 |
| 9292614 | Method for transmitting information between multiple electronic pages | Chih-Chiang Lin, Hung-Chun Kao, Yu-Sheng Lin, Ting-Yu Chiang, Shih-Hui Wu +10 more | 2016-03-22 |