Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530715 | Thermally enhanced structure for multi-chip device | Chen-Hua Yu, Tung-Liang Shao | 2016-12-27 |
| 9521795 | Two-step direct bonding processes and tools for performing the same | Yi-Li Hsiao, Da-Yuan Shih, Chen-Hua Yu | 2016-12-13 |
| 9475145 | Solder bump joint in a device including lamellar structures | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Da-Yuan Shih +1 more | 2016-10-25 |
| 9472524 | Copper-containing layer on under-bump metallization layer | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Kai-Chiang Wu, Ming-Che Ho | 2016-10-18 |
| 9455183 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Cheng-Chang Wei | 2016-09-27 |
| 9343436 | Stacked package and method of manufacturing the same | Yi-Li Hsiao, Li-Yen Lin | 2016-05-17 |
| 9331038 | Semiconductor interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-05-03 |
| 9293437 | Functional block stacked 3DIC and method of making same | Chen-Hua Yu, Kuo-Chung Yee | 2016-03-22 |
| 9263407 | Method for manufacturing a plurality of metal posts | Yi-Li Hsiao, Su-Chun Yang, Da-Yuan Shih, Chen-Hua Yu | 2016-02-16 |