Issued Patents 2016
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508637 | Protrusion bump pads for bond-on-trace processing | Chen-Shien Chen, Yu-Feng Chen, Yu-Wei Lin, Tin-Hao Kuo, Yu-Min Liang | 2016-11-29 |
| 9508128 | Image-correction system and method | — | 2016-11-29 |
| 9502426 | One time programming non-volatile memory cell | Ping-Yu Kuo, Kuan-Hsun Chen | 2016-11-22 |
| 9502360 | Stress compensation layer for 3D packaging | Yu-Feng Chen, Han-Ping Pu, Hung-Jui Kuo | 2016-11-22 |
| 9472481 | Packages with stress-reducing structures and methods of forming same | — | 2016-10-18 |
| 9472524 | Copper-containing layer on under-bump metallization layer | Yu-Feng Chen, Han-Ping Pu, Chih-Hang Tung, Kai-Chiang Wu, Ming-Che Ho | 2016-10-18 |
| 9460797 | Non-volatile memory cell structure and non-volatile memory apparatus using the same | Chih-Chun Chen, Cheng-Da Huang | 2016-10-04 |
| 9418956 | Zero stand-off bonding system and method | Ming-Che Ho, Yu-Feng Chen, Yi-Wen Wu, Hsien-Liang Meng, Han-Ping Pu | 2016-08-16 |
| 9418947 | Mechanisms for forming connectors with a molding compound for package on package | Yu-Feng Chen, Han-Ping Pu, Ming-Da Cheng, Kai-Chiang Wu | 2016-08-16 |
| 9391012 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Hsien-Wei Chen, Yu-Feng Chen, Ming-Kai Liu, Chun-Lin Lu | 2016-07-12 |
| 9355928 | Package-on-package structure | Yu-Feng Chen, Han-Ping Pu, Chun-Cheng Lin, Ming-Da Cheng, Kai-Chiang Wu | 2016-05-31 |
| 9324587 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chih-Fan Huang, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2016-04-26 |
| 9282592 | Rotatable heating-cooling plate and element in proximity thereto | Jui-Chun Peng, Jacky Chung, Heng-Hsin Liu | 2016-03-08 |