Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484308 | Semiconductor device | Chao-Wen Shih, Yung-Ping Chiang | 2016-11-01 |
| 9472523 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Shih-Wei Liang, Yen-Ping Wang, Kai-Chiang Wu | 2016-10-18 |
| 9460989 | Interposer having a defined through via pattern | Shih-Wei Liang, Kai-Chiang Wu, Chia-Chun Miao, Chun-Lin Lu | 2016-10-04 |
| 9412661 | Method for forming package-on-package structure | Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang | 2016-08-09 |
| 9391012 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Hsien-Wei Chen, Yu-Feng Chen, Chun-Hung Lin, Chun-Lin Lu | 2016-07-12 |
| 9373599 | Methods and apparatus for package on package devices | Kai-Chiang Wu, Hsien-Wei Chen, Shih-Wei Liang | 2016-06-21 |
| 9355924 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Chia-Chun Miao +1 more | 2016-05-31 |
| 9331023 | Device packaging | Yu-Peng Tsai, Kai-Chiang Wu, Wei-Hung Lin, Hao-Yi Tsai, Mirng-Ji Lii | 2016-05-03 |