Issued Patents 2016
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530759 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu +1 more | 2016-12-27 |
| 9484308 | Semiconductor device | Ming-Kai Liu, Yung-Ping Chiang | 2016-11-01 |
| 9437490 | Semiconductor device and manufacturing method thereof | Tsung-Yuan Yu, Hao-Yi Tsai, Hung-Yi Kuo, Pi-Lan Chang | 2016-09-06 |
| 9431360 | Semiconductor structure and manufacturing method thereof | Hsuan-Ting Kuo, Yu-Peng Tsai, Wei-Hung Lin, Chun-Lung Jao, Ming-Da Cheng +1 more | 2016-08-30 |
| 9397056 | Semiconductor device having trench adjacent to receiving area and method of forming the same | Yen-Ping Wang, Yung-Ping Chiang, Shih-Wei Liang, Tsung-Yuan Yu, Hao-Yi Tsai +2 more | 2016-07-19 |
| 9379076 | Semiconductor device and manufacturing method thereof | Chen-Chih Hsieh, Hao-Yi Tsai, Yung-Ping Chiang, Tsung-Yuan Yu | 2016-06-28 |
| 9343415 | Copper post structure for wafer level chip scale package | Yung-Ping Chiang, Chen-Chih Hsieh, Hao-Yi Tsai | 2016-05-17 |
| 9343385 | Semiconductor device comprising a chip substrate, a mold, and a buffer layer | Nien-Fang Wu, Yung-Ping Chiang, Hao-Yi Tsai | 2016-05-17 |
| 9333653 | Automatic pill grasping apparatus and method | SZU-HAI HUANG, Kuo-Ming Lai, PEI-YI CHAN, JENG-CHE CHEN, TUI-CHIEN WU +3 more | 2016-05-10 |
| 9305877 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu +1 more | 2016-04-05 |
| 9284111 | Automatic pill grasping apparatus | SZU-HAI HUANG, Kuo-Ming Lai, PEI-YI CHAN, JENG-CHE CHEN, TUI-CHIEN WU +3 more | 2016-03-15 |
| 9236322 | Methods and apparatus for heat spreader on silicon | Hsien-Wei Chen, Chung-Ying Yang, Kai-Chiang Wu | 2016-01-12 |