Issued Patents 2016
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530759 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Chao-Wen Shih, Tsung-Yuan Yu +1 more | 2016-12-27 |
| 9530757 | Single mask package apparatus | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen | 2016-12-27 |
| 9502627 | Wafer level photonic devices dies structure and method of making the same | Chih-Kuang Yu | 2016-11-22 |
| 9490203 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2016-11-08 |
| 9437490 | Semiconductor device and manufacturing method thereof | Tsung-Yuan Yu, Hao-Yi Tsai, Chao-Wen Shih, Pi-Lan Chang | 2016-09-06 |
| 9425112 | Calibration kits for RF passive devices | Jie Chen, Hao-Yi Tsai, Hsien-Wei Chen | 2016-08-23 |
| 9406739 | Inductor system and method | Hao-Yi Tsai, Hsien-Wei Chen, Tsung-Yuan Yu | 2016-08-02 |
| 9379067 | Semiconductor devices and methods of manufacture thereof having guard ring structure | Hsien-Wei Chen, Nien-Fang Wu, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2016-06-28 |
| 9379299 | LED device with improved thermal performance | Hsing-Kuo Hsia, Chih-Kuang Yu, Chyi Shyuan Chern | 2016-06-28 |
| 9355954 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2016-05-31 |
| 9305877 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Chao-Wen Shih, Tsung-Yuan Yu +1 more | 2016-04-05 |
| 9287478 | Method and apparatus for accurate die-to-wafer bonding | Chyi Shyuan Chern, Hsin-Hsien Wu, Chih-Kuang Yu | 2016-03-15 |
| 9245842 | Semiconductor devices having guard ring structure and methods of manufacture thereof | Hsien-Wei Chen, Nien-Fang Wu, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2016-01-26 |
| 9240163 | Video wall | Chia-Hung Su | 2016-01-19 |