Issued Patents 2016
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502270 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Hsien-Wei Chen | 2016-11-22 |
| 9490203 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Tsung-Yuan Yu +1 more | 2016-11-08 |
| 9490192 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen | 2016-11-08 |
| 9478521 | Package-on-package Structure | Hsien-Wei Chen, An-Jhih Su | 2016-10-25 |
| 9461020 | Semiconductor package including an embedded surface mount device and method of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Ming-Yen Chiu | 2016-10-04 |
| 9437567 | Semiconductor devices with ball strength improvement | Tsung-Yuan Yu, Hsien-Wei Chen, Shih-Wei Liang | 2016-09-06 |
| 9391028 | Integrated circuit dies having alignment marks and methods of forming same | Hsien-Wei Chen | 2016-07-12 |
| 9381175 | Method for treating Chikungunya virus infection | Szu-Cheng KUO, Tzong-Yuan Wu, Chang-Chi LIN, Yu Wang | 2016-07-05 |
| 9379067 | Semiconductor devices and methods of manufacture thereof having guard ring structure | Hsien-Wei Chen, Nien-Fang Wu, Hung-Yi Kuo, Jie Chen, Tsung-Yuan Yu | 2016-06-28 |
| 9368417 | Contact test structure and method | Jie Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2016-06-14 |
| 9355954 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Tsung-Yuan Yu +1 more | 2016-05-31 |
| 9349665 | Methods and apparatus of packaging of semiconductor devices | Hsien-Wei Chen, Tsung-Yuan Yu, Jie Chen | 2016-05-24 |
| 9328147 | Recombinant baculovirus vector and uses thereof | Tzong-Yuan Wu, Mean-Shine Chen, Chao-Yi Teng | 2016-05-03 |
| 9313629 | Method and system for filtering incoming messages to a mobile device | John C. Wang | 2016-04-12 |
| 9267113 | Hybrid baculovirus and uses thereof | Tzong-Yuan Wu, Mean-Shine Chen, Chao-Yi Teng, Chung-Hsiung Wang | 2016-02-23 |
| 9269682 | Method of forming bump structure | Tsung-Yuan Yu, Hsien-Wei Chen | 2016-02-23 |
| 9269675 | Semiconductor device and manufacturing method thereof | Hsien-Wei Chen | 2016-02-23 |
| 9263354 | Pillar structure having cavities | Hsien-Wei Chen | 2016-02-16 |
| 9245842 | Semiconductor devices having guard ring structure and methods of manufacture thereof | Hsien-Wei Chen, Nien-Fang Wu, Hung-Yi Kuo, Jie Chen, Tsung-Yuan Yu | 2016-01-26 |