Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530715 | Thermally enhanced structure for multi-chip device | Chen-Hua Yu, Chih-Hang Tung | 2016-12-27 |
| 9490203 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2016-11-08 |
| 9484318 | Semiconductor device and manufacturing method thereof | Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang | 2016-11-01 |
| 9449927 | Seal ring structure with metal-insulator-metal capacitor | Hsien-Wei Chen, Ching-Jung Yang, Yu-Chia Lai, Hao-Yi Tsai, Tsung-Yuan Yu | 2016-09-20 |
| 9355954 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2016-05-31 |
| 9343417 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Ching-Jung Yang, Yu-Chia Lai | 2016-05-17 |
| 9318456 | Self-alignment structure for wafer level chip scale package | Yu-Chia Lai, Hsien-Ming Tu, Hsien-Wei Chen, Chang-Pin Huang, Ching-Jung Yang | 2016-04-19 |