Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484318 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Yu-Chia Lai, Hsien-Ming Tu, Ching-Jung Yang | 2016-11-01 |
| 9461106 | MIM capacitor and method forming the same | Ching-Jung Yang, Hsien-Ming Tu, Hao-Yi Tsai, Mirng-Ji Lii, Shih-Wei Liang +1 more | 2016-10-04 |
| 9343417 | Hollow metal pillar packaging scheme | Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2016-05-17 |
| 9318456 | Self-alignment structure for wafer level chip scale package | Yu-Chia Lai, Hsien-Ming Tu, Tung-Liang Shao, Hsien-Wei Chen, Ching-Jung Yang | 2016-04-19 |