Issued Patents 2016
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9497861 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Ching-Feng Yang | 2016-11-15 |
| 9472523 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Yen-Ping Wang, Kai-Chiang Wu, Ming-Kai Liu | 2016-10-18 |
| 9461106 | MIM capacitor and method forming the same | Ching-Jung Yang, Chang-Pin Huang, Hsien-Ming Tu, Hao-Yi Tsai, Mirng-Ji Lii +1 more | 2016-10-04 |
| 9460989 | Interposer having a defined through via pattern | Kai-Chiang Wu, Ming-Kai Liu, Chia-Chun Miao, Chun-Lin Lu | 2016-10-04 |
| 9437567 | Semiconductor devices with ball strength improvement | Tsung-Yuan Yu, Hsien-Wei Chen, Ying-Ju Chen | 2016-09-06 |
| 9397056 | Semiconductor device having trench adjacent to receiving area and method of forming the same | Yen-Ping Wang, Chao-Wen Shih, Yung-Ping Chiang, Tsung-Yuan Yu, Hao-Yi Tsai +2 more | 2016-07-19 |
| 9373599 | Methods and apparatus for package on package devices | Ming-Kai Liu, Kai-Chiang Wu, Hsien-Wei Chen | 2016-06-21 |
| 9355924 | Integrated circuit underfill scheme | Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao +1 more | 2016-05-31 |
| 9337154 | Semiconductor device and method of manufacturing the same | Chia-Chun Miao, Yen-Ping Wang, Hao-Yi Tsai, Tsung-Yuan Yu | 2016-05-10 |
| 9337117 | Chip package and method of manufacturing the same | Chung-Ying Yang, Hsien-Wei Chen, Tsung-Yuan Yu | 2016-05-10 |
| 9263405 | Semiconductor device | Chia-Chun Miao, Kai-Chiang Wu, Yen-Ping Wang | 2016-02-16 |