Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9497861 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang | 2016-11-15 |
| 9472523 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Shih-Wei Liang, Kai-Chiang Wu, Ming-Kai Liu | 2016-10-18 |
| 9397056 | Semiconductor device having trench adjacent to receiving area and method of forming the same | Chao-Wen Shih, Yung-Ping Chiang, Shih-Wei Liang, Tsung-Yuan Yu, Hao-Yi Tsai +2 more | 2016-07-19 |
| 9355924 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu +1 more | 2016-05-31 |
| 9337154 | Semiconductor device and method of manufacturing the same | Chia-Chun Miao, Hao-Yi Tsai, Shih-Wei Liang, Tsung-Yuan Yu | 2016-05-10 |
| 9263405 | Semiconductor device | Chia-Chun Miao, Shih-Wei Liang, Kai-Chiang Wu | 2016-02-16 |