Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9497861 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2016-11-15 |
| 9478511 | Methods and apparatus of packaging semiconductor devices | Hsien-Wei Chen, Kai-Chiang Wu, Hung-Jui Kuo | 2016-10-25 |
| 9460989 | Interposer having a defined through via pattern | Shih-Wei Liang, Kai-Chiang Wu, Ming-Kai Liu, Chia-Chun Miao | 2016-10-04 |
| 9412661 | Method for forming package-on-package structure | Ming-Kai Liu, Kai-Chiang Wu, Ching-Feng Yang | 2016-08-09 |
| 9391012 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Hsien-Wei Chen, Yu-Feng Chen, Chun-Hung Lin, Ming-Kai Liu | 2016-07-12 |
| 9355924 | Integrated circuit underfill scheme | Shih-Wei Liang, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao +1 more | 2016-05-31 |
| 9355982 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu | 2016-05-31 |