Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9497861 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang | 2016-11-15 |
| 9412661 | Method for forming package-on-package structure | Chun-Lin Lu, Ming-Kai Liu, Kai-Chiang Wu | 2016-08-09 |
| 9355924 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Chia-Chun Miao +1 more | 2016-05-31 |