Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472523 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Yen-Ping Wang, Kai-Chiang Wu, Ming-Kai Liu | 2016-10-18 |
| 9460989 | Interposer having a defined through via pattern | Shih-Wei Liang, Kai-Chiang Wu, Ming-Kai Liu, Chun-Lin Lu | 2016-10-04 |
| 9355924 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu +1 more | 2016-05-31 |
| 9337154 | Semiconductor device and method of manufacturing the same | Yen-Ping Wang, Hao-Yi Tsai, Shih-Wei Liang, Tsung-Yuan Yu | 2016-05-10 |
| 9263405 | Semiconductor device | Shih-Wei Liang, Kai-Chiang Wu, Yen-Ping Wang | 2016-02-16 |