Issued Patents 2016
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530759 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Chao-Wen Shih +1 more | 2016-12-27 |
| 9490203 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen +1 more | 2016-11-08 |
| 9449927 | Seal ring structure with metal-insulator-metal capacitor | Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai, Hao-Yi Tsai | 2016-09-20 |
| 9443812 | Semiconductor device with post-passivation interconnect structure and method of forming the same | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2016-09-13 |
| 9437490 | Semiconductor device and manufacturing method thereof | Hao-Yi Tsai, Chao-Wen Shih, Hung-Yi Kuo, Pi-Lan Chang | 2016-09-06 |
| 9437739 | Finfet seal ring | Hsien-Wei Chen | 2016-09-06 |
| 9437567 | Semiconductor devices with ball strength improvement | Hsien-Wei Chen, Ying-Ju Chen, Shih-Wei Liang | 2016-09-06 |
| 9406739 | Inductor system and method | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2016-08-02 |
| 9401308 | Packaging devices, methods of manufacture thereof, and packaging methods | Hsien-Wei Chen | 2016-07-26 |
| 9397056 | Semiconductor device having trench adjacent to receiving area and method of forming the same | Yen-Ping Wang, Chao-Wen Shih, Yung-Ping Chiang, Shih-Wei Liang, Hao-Yi Tsai +2 more | 2016-07-19 |
| 9396973 | Methods and apparatus for wafer level packaging | Hsien-Wei Chen, Wen-Hsiung Lu, Hung-Jen Lin | 2016-07-19 |
| 9379076 | Semiconductor device and manufacturing method thereof | Chen-Chih Hsieh, Hao-Yi Tsai, Chao-Wen Shih, Yung-Ping Chiang | 2016-06-28 |
| 9379067 | Semiconductor devices and methods of manufacture thereof having guard ring structure | Hsien-Wei Chen, Nien-Fang Wu, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen | 2016-06-28 |
| 9368417 | Contact test structure and method | Jie Chen, Hsien-Wei Chen, Ying-Ju Chen | 2016-06-14 |
| 9362243 | Semiconductor package device and forming the same | — | 2016-06-07 |
| 9355978 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2016-05-31 |
| 9355954 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen +1 more | 2016-05-31 |
| 9355906 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Ming-Da Cheng, Wen-Hsiung Lu | 2016-05-31 |
| 9349665 | Methods and apparatus of packaging of semiconductor devices | Hsien-Wei Chen, Jie Chen, Ying-Ju Chen | 2016-05-24 |
| 9337117 | Chip package and method of manufacturing the same | Chung-Ying Yang, Hsien-Wei Chen, Shih-Wei Liang | 2016-05-10 |
| 9337154 | Semiconductor device and method of manufacturing the same | Chia-Chun Miao, Yen-Ping Wang, Hao-Yi Tsai, Shih-Wei Liang | 2016-05-10 |
| 9305877 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Chao-Wen Shih +1 more | 2016-04-05 |
| 9287143 | Apparatus for package reinforcement using molding underfill | Hsien-Wei Chen, Wen-Hsiung Lu, Ming-Da Cheng, Hao-Yi Tsai, Mirng-Ji Lii +1 more | 2016-03-15 |
| 9275925 | System and method for an improved interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2016-03-01 |
| 9269682 | Method of forming bump structure | Hsien-Wei Chen, Ying-Ju Chen | 2016-02-23 |