Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9396973 | Methods and apparatus for wafer level packaging | Tsung-Yuan Yu, Hsien-Wei Chen, Wen-Hsiung Lu | 2016-07-19 |
HL
Hung-Jen Lin
Overall (2016): #376,110 of 481,213Top 80%
1
Patents 2016