Issued Patents 2016
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449933 | Packaging device and method of making the same | Chang-Chia Huang, Tsung-Shu Lin, Ming-Da Cheng, Bor-Rung Su | 2016-09-20 |
| 9449931 | Pillar bumps and process for making same | Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo-Cheng Lin, Chien Ling Hwang +2 more | 2016-09-20 |
| 9437564 | Interconnect structure and method of fabricating same | Hsuan-Ting Kuo, Cheng-Ting Chen, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2016-09-06 |
| 9412717 | Apparatus and methods for molded underfills in flip chip packaging | Meng-Tse Chen, Hsiu-Jen Lin, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9396973 | Methods and apparatus for wafer level packaging | Tsung-Yuan Yu, Hsien-Wei Chen, Hung-Jen Lin | 2016-07-19 |
| 9385076 | Semiconductor device with bump structure on an interconncet structure | Hsien-Wei Chen, Yi-Wen Wu | 2016-07-05 |
| 9385040 | Method of manufacturing a semiconductor device | Tsai-Tsung Tsai, Yu-Peng Tsai, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-07-05 |
| 9373610 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Kuei-Wei Huang, Chung-Shi Liu | 2016-06-21 |
| 9368462 | Methods and apparatus of packaging semiconductor devices | Yi-Wen Wu, Ming-Che Ho, Chia-Wei Tu, Chung-Shi Liu | 2016-06-14 |
| 9368398 | Interconnect structure and method of fabricating same | Wei-Yu Chen, Hsuan-Ting Kuo, Ming-Da Cheng, Chung-Shi Liu | 2016-06-14 |
| 9355927 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Cheng-Ting Chen, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng +1 more | 2016-05-31 |
| 9355906 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2016-05-31 |
| 9312214 | Semiconductor packages having polymer-containing substrates and methods of forming same | Meng-Tse Chen, Chih-Wei Lin, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-04-12 |
| 9287203 | Package-on-package structure and method of forming same | Chih-Wei Lin, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-03-15 |
| 9287143 | Apparatus for package reinforcement using molding underfill | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng, Hao-Yi Tsai, Mirng-Ji Lii +1 more | 2016-03-15 |
| 9269658 | Ball amount process in the manufacturing of integrated circuit | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2016-02-23 |
| 9263839 | System and method for an improved fine pitch joint | Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2016-02-16 |
| 9257333 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-02-09 |